Chip-Agnostic Modular Power stage platform
Power Electronics Reimagined
Scalable, Flexible & Supplier-Independent soultions for Next-gen power system
Welcome
to NEXIS GLOBAL
Chip & Device- Agnostic power stage architecture
Reducing redesign risk and supply-chain dependency
in high-efficiency power systems.
An architecture-first approachi to modular power stage design.
Chip & Device Agnostic Power stage architecture
Reducing redesign risk and supply-chain dependency
in power electronics system.
An architecture first approachi to modular power stage design.
System-level challenges.
In modern power systems, power stage designs are tightly coupled to specific semiconductor devices and vendors. As a result, even minor device and supply changes often require full redesign, increasing development time, certification cost and supply risk.
Development Cost risk
Repeated redesign cycles increase engineering effort and non recurring costs.
Supply chain risk
Vendor-specific designs amplify exposure to component shortages and geoplitical disruptions.
Certification Burden
Even small design changes an trigger time - consuming re-certification processes.
Architecture overview
Conceptual redering of a device power stage module architecutre
NEXIS GLOBAL is exploring a modular power stage architecture designed to decouple system design from device selection while maintaning comparable thermal and electrical performance.
Increasing power density, growing device diversity and recent supply chain disruptions are exposing tructural limitations in conventional power stage design.
Increasing power density, growing device diversity and recent supply chain disruptions are exposing tructural limitations in conventional power stage design.
Architecture overview
Conceptual redering of a device power stage module architecutre
NEXIS GLOBAL is exploring a modular power stage architecture designed to decouple system design from device selection while maintaning comparable thermal and electrical performance.
Our Approach
Architecture Approach
Why now?
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Architecture-Level abstracition of power stage
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Support for multiple device option within a standardizaed interface.
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Focus on Flexibility, scalability and supply resilience.
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Focus on system-level risk reduction.
Increasing power density, growing device diversity and recent supply chain disruptions are exposing tructural limitations in conventional power stage design.
DESIGN PHILOSOPHY
<Architecture Before Optimization>
Power stage design is not a single-variable optimization problem.
Electrical performance, thermal behavior, mechanical constraints, compliance requirements and supply availability are deeply interdependent.
Conventional designs often optimize aggressively around a specific device or vendor.
while this can maximize peak performance, it also tightly couples the system to fixed component assumptions.
Rather than optimizing for peak performance with a single device, NEXIS GLOBAL prioritizes maintaining defined
system level performance envelopes across multiple device options.
VALIDATION LOGIC
<Proving architecture viability without overclaiming>
Validation is defined at the system level, not at the level of individual devices.
Thermal Envelope
Validation
we validate that thermal behavior remains within defined system-level envelopes across supported device classes.
Electrical Performance Consistency
Electrical performance is evaluated to confirm functional equivalence and stability across mutiple device options.
Interface & Boundary
Integrity
Mehanical, electrical and control interfaces are validated to ensure that device changes do not propagate system-lelvel redesign.
Validation is conducted through a combination of tool-based simulation, boundary stress analysis
and PoC-Level hardware evaluation.
We do not attempt to exhaustively validate every possible device configuration.
Insted, we validate architecture boundaries that define where flexibility is allowed and where constraints must remain fixed.
The goal of validation is not to prove maximum performance, but to confirm architecture robustness.
At the same time, architecture robustness is not achieved by compromising core thermal or electrical capability.
Our approach assumes strong baseline thermal and electrical performance as a prerequisite and focuses validation on
ensuring that this performance is consistently maintained across suppoerted device option.
WHO This Is For
<Designed for teams managing system-level risk>
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System integrators and power electronics teams in EV, UPS, ESS, Data Centers, Aerospace & Defense.
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Engineering teams struggling with vendoer lock-in and redesign overhead
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OEM's who must manage supply chain risk and certification cost
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Companies needing flexible, scalable, high-efficiency power stages without redesign burden.
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Partners looking for modular, future - ready GaN / SiC power solutions.
Power electronics teams
Engineering teams designing high-efficiency power stages who need to support multiple semiconductor vendors.
System integrators & module designers
Teams building power modules or subsystems that must remain flexible across different devices and suppliers.
Companies facing supply-chain uncertainty
Organizations affected by semiconductor supply volatility seeking architecture-level resilience.
Early-stage product teams
Product teams that need fast iteration without commitiing to a single device vendor too early.
FOOTER
Member, NVIDIA Inception program